ISQED 2018 Technical Program Committee
Hai Li, Duke University (General Chair)
Brian Cline, ARM (General Co-Chair)
Steve Heinrich-Barna, Texas Instruments (TPC Chair)
Swaroop Ghosh, Pennsylvania State University (TPC Co-Chair)
3 Dimensional Integration &Adv. Packaging (TDIP)
Sung Kyu Lim, Georgia Tech (Chair)
Kambiz Samadi, Qualcomm Technologies, Inc. (Co-Chair)
Payman Zarkesh-Ha, University of New Mexico (Co-Chair)
Committee Members:
Ismail Bustany - Mentor Graphics
Nauman Khan - Intel Coporation
Dae Hyun Kim - Washington State University
Shreepad Panth - Altera Corporation, An Intel Company
Yiyu Shi - University of Notre Dame
Saurabh Sinha - ARM Inc.
Jianyong Xie - Intel
Hirokazu Yonezawa - Panasonic Corporation
Ehrenfried Zschech - Fraunhofer IKTS
Cognitive Computing in Hardware (CCH)
Yiran Chen, Duke University (Chair)
Yang (Cindy) Yi, Virginia Tech (Co-Chair)
Committee Members:
Abishai Daniel - Intel
Xin Fu - University of Houston
Miao Hu - Binghamton University
Hao Jiang - San Francisco State University
Amey Kulkarni - Velodyne LiDAR
Hai (Helen) Li - Duke University/TUM-IAS
Xue Lin - Northeastern University
BEIYE LIU - University of Pittsburgh
Design Technology Co-Optimization (DTCO)
Fedor Pikus, Mentor Graphics, Inc (Chair)
Rajan Beera, Pall Corporation (Co-Chair)
Vivek Joshi, GLOBALFOUNDRIES (Co-Chair)
Committee Members:
Kevin Brelsford - Synopsys
Tuhin Guha Neogi - GLOBALFOUNDRIES
Sumeet Gupta - The Pennsylvania State University
Murari Mani - Mentor Graphics
Kun Qian - GLOBALFOUNDRIES
Mustafa Berke Yelten - Istanbul Technical University
Vladimir Zolotov - IBM
Design Verification and Design Testability (DVFT)
Sreejit Chakravarty, Intel Corporation (Chair)
Vinod Viswanath, Real Intent, Inc. (Co-Chair)
Committee Members:
George Alexiou - Univ. Of PATRAS
Alberto Bosio - LIRMM
Yu Cai - SK Hynix
Serge Demidenko - Massey University
Michael Hsiao - Virginia Tech
Jon Nafziger - Texas Instruments
Dimitris Nikolos - University of Patras
Kiran Puttaswamy - Samsung
Arani Sinha - Intel
Spyros Tragoudas - Southern Illinois University Carbondale
Miroslav N. Velev - Aries Design Automation
Arnaud Virazel - LIRMM
Charles WEN - Dept. Electrical and Computer Engineering, National Chiao Tung University
EDA, Physical Design, and IP Cores (EDA)
Srinivas Katkoori, University of South Florida (Chair)
Srini Krishnamoorthy, Advanced Micro Devices Inc. (Co-Chair)
Committee Members:
Yici Cai - Tsinghua Univ.
Eric Foreman - IBM
Dhruva Ghai - ORIENTAL UNIVERSITY INDORE
Shih-Hsu Huang - Chung Yuan Christian University
Anand Iyer - Microsoft
Yu-Min Lee - National Chiao Tung University
Rung-Bin Lin - Yuan Ze University
Ofelya Manukyan - CAD/EDA R&D, Synopsys
Gayatri Mehta - University of North Texas
Rajeev Murgai - Synopsys India Pvt. Ltd.
Siddhartha Nath - Synopsys Inc.
Andre Reis - UFRGS
Emre Salman - Stony Brook University
Takashi Sato - Kyoto University
Vinod Viswanath - Real Intent, Inc.
Jia Wang - Illinois Institute of Technology
Hua Xiang - IBM Research
Guo Yu - Oracle
Min Zhao - oracle
Emerging Process&Device Tech. &Design Issues (EDT)
Shih-Hung Chen, Imec (Chair)
Jayita Das, Intel Corp. (Co-Chair)
Committee Members:
Qiang Cui - Qorvo Inc.
Abishai Daniel - Intel
Sumeet Gupta - The Pennsylvania State University
Kuo-Hsing Kao - National Cheng Kung University
Nikos Konofaos - Aristotle University of Thessaloniki
Chun-Yu Lin - National Taiwan Normal University
Renato Ribas - UFRGS
Swatilekha Saha - Cypress Semiconductor Corporation
Kazuyuki Tomida - SONY
Rasit Onur Topaloglu - IBM
Amit Trivedi - University of Illinois at Chicago
Hardware and System Security (HSS)
Gang Qu, Univ. of Maryland, College Park (Chair)
Arnett Brown, Booz Allen Hamilton (Co-Chair)
Committee Members:
Shivam Bhasin - Temasek Laboratories, Nanyang Technological University
Anupam Chattopadhyay - Nanyang Technological University
Jia Di - University of Arkansas
Domenic Forte - University of Florida
Swaroop Ghosh - Pennsylvania State University
Yier Jin - University of Florida
Amey Kulkarni - Velodyne LiDAR
Ken Mai - Carnegie Mellon University
Seetharam Narasimhan - Intel Corp
Jiliang Zhang - Hunan University
Integrated Circuit Design (ICD)
Kurt Schwartz, Texas Instruments (Chair)
Jose Pineda, NXP Semiconductors (Co-Chair)
Committee Members:
Ali Afzali-Kusha - University of Tehran
Karan Bhatia - Texas Instruments, Inc.
Srinivas Bodapati - Intel
Paulo Butzen - Universidade Federal do Rio Grande - FURG
subho chatterjee - intel corporation
Minki Cho - Intel Corp.
Mike DiRenzo - Texas Instruments
Tobias Gemmeke - RWTH Aachen University
Guanming Huang - Synopsys
Jos Huisken - TU Eindhoven
Rouwaida Kanj - American University of Beirut
Jin-Fu Li - National Central University
Aswin Mehta - Texas Instruments Inc
Riaz Naseer - Rockwell Automation
Yu Pu - Qualcomm Research
Raviprakash Rao - Texas Instruments
Jeremy Tolbert - GLOBALFOUNDRIES
Vishnoi Upasna - Marvell Semiconductor Inc.
Haibo Wang - Texas A&M International University
Cheng Zhuo - Zhejiang University
Amir Zjajo - Delft University of Technology
IoT –Design & Smart Sensors (SSDT)
Xiaoning Qi, C-SKY Microsystems Corp (Chair)
Libor Rufer, University of Grenoble-Alpes (Co-Chair)
Committee Members:
Pradeep Chawda - Texas Instruments
Abishai Daniel - Intel
Vittorio Ferrari - University of Brescia
Joshua Lee - City University of Hong Kong
Michel Maharbiz - U.C. Berkeley
Thilo Sauter - Danube University Krems
Adrian Tung - Intel
Yanzhi Wang - University of Southern California
System-level Design and Methodologies (SDM)
Rajesh Berigei, Self (Chair)
Shiyan Hu, Michigan Technological University (Co-Chair)
Committee Members:
Ping Chi - Intel Corporation
Kai Cong - Intel Corporation
Fabiano Hessel - PUCRS
Selcuk Kose - University of South Florida
Hana Kubatova - CTU in Prague
Hai (Helen) Li - Duke University/TUM-IAS
Duo Liu - Chongqing University
Vivek nandakumar - Cadence Design Systems
Gabriela Nicolescu - Ecole Polytechnique de Montréal
Antonio Nunez - University of Las Palmas GC
Sudeep Pasricha - Colorado State University
Shanq-Jang Ruan - National Taiwan University of Sci. and Tech.
Bei Yu - The Chinese University of Hong Kong
Special Sessions
Jayita Das, Intel Corp. (Chair)
Brian Cline, ARM Inc. (Co-Chair)