Keynotes at ISQED 2015
- Check out selected keynotes from previous years.
Tuesday & Wednesday March 3-4
Rethinking Design Creation, Verification and Validation for the Internet of Things
George ZafiropoulosGeorge Zafiropoulos - Vice President of Solutions Marketing in the AWR Group , National Instruments
The proliferation of IoT devices is driving the design process to produce ever smaller, lower cost, and more highly integrated systems, with shorter time to market. To meet these challenges, we need to streamline the process of design and test and look for opportunities to become much more efficient. New methodolodies we be necessary to improve the design to test flow, system validation and improve test IP re-use. In this presentation we will explore some ideas of how to improve the overall design and test process.
About George Zafiropoulos
George Zafiropoulos is Vice President of Solutions Marketing in the AWR Group of National Instruments. George has spent over 30 years in semiconductor design automation engineering, marketing, and executive management roles at Quickturn, Synopsys, and Cadence. In his role at National Instruments, George is looking at methods to improve the overall design to test process including analog, digital, RF and embedded software. George is also on the board of Ladera Labs and TeleSense, two IoT startups in Silicon Valley.
What's Really Driving the Internet of Things? – Insights on the Market, Technology and Challenges
Mike BallardMike Ballard - Sr. Manager, Home Appliance Solutions and Smart Energy Groups, Microchip Technology
The Internet of Things is an embryonic market that is currently driving a great deal of interest within the semiconductor industry. Not only as a compelling and potentially huge market that will create new sources of revenue for years to come, but also as a platform for technology innovations. But what is really behind this interest? What benefits could be derived from adding technology to many everyday products? What challenges do designers face when architecting these innovative systems? This keynote will answer these questions while providing a high-level overview of the market and insight into its differing communication standards. It will also discuss the challenges that extend beyond the embedded product, such as security and connecting to the cloud.
About Mike Ballard
Michael Ballard received his Bachelor's of Science in Electrical Engineering from Ohio University's Russ College of Engineering and Technology. He began his career in the power-generation market and then migrated over to automotive electronics, where he spent 10 years with automotive OEMs and semiconductor providers. In 2007, Michael transitioned into the appliance market as the Manager of Microchip's Home Appliance Solutions Group. In 2010, in addition to his Home Appliance responsibilities, Michael was charged with running the newly-created Smart Energy Group. In 2012, due to his group's knowledge and leadership in the emerging market, he also created a new team at Microchip focused on the Internet of Things. Michael has also been the leader of Microchip's Marketing Council for the past two years. He has been an industry leader in the Smart-Energy, IoT, and Appliance markets, and has written many papers and articles. Additionally, Michael sits on a number of task forces and advisory panels associated with these industries, including serving as a member of the Boards of Directors for the Association of Home Appliance Manufacturers (AHAM) and USNAP.
From Cluster to Cloud: How to Harness the Internet of Things
Clodoaldo BarreraClodoaldo Barrera - Distinguished Engineer and the Chief Technical Strategist , IBM
The Internet of Things and smart sensors are generating ever increasing amounts of data. Organizations are using public and private clouds to transfer and process this data, but bringing along challenges such as data duplication, under utilized disk storage and idle CPUs, with little or no prioritization. New developments in data aware scheduling will be described. These work with IBM Platform Computing workload management tools and intelligent caching to schedule and deliver data using the cloud. Combined with powerful solutions, this talk will highlight how organizations take advantage of intelligent data scheduling, enhanced workload management and efficient compute utilization, including case studies and client examples. Further the talk will showcase how all of these technologies are making cloud computing less expensive and more secured.
About Clodoaldo Barrera
Clodoaldo Barrera is a Distinguished Engineer and the Chief Technical Strategist for IBM Systems Storage in San Jose California. Clod has had a distinguished career across multiple generations of storage technology. Clod led the Advanced Controller development at IBM, which produced high end and midrange RAID disk arrays. Clod set IBM's direction for SAN storage, and helped establish a product eco-system that remains in place today. Clod was a founding member of the SNIA, and served as a board member and officer of SNIA, FCIA, and SSAIA. More recently Clod has set technology direction for storage encryption, compression, object storage, cloud architectures, and software defined storage. Clod holds BS and MS degrees from Stanford University, and is a senior member of IEEE Computer Society.
Connecting the Dots to achieve high Reliability and Quality
Raj N. MasterRaj N. Master - General Manager, Reliability, Quality and Silicon Operations , Microsoft
The ubiquitous trend towards a connected, digital, always-ON lifestyle is driving the development of electronic devices that have smaller form factors, higher performance requirements, along with expectations of reliability and quality. Consumers don't buy products because of high quality but expect it. The result is a constant upward pressure on delivering high reliability at silicon, package and system level. Although this general trend holds for applications in the computing arena, gaming console arena, consumer electronics arena as well as in the portable electronics arena, the relative constraints on the cost, size and complexity of the products make this a challenging task. This is further made more difficult by unpredictable ways consumers may use the product. Microsoft evolution of hardware and reliability challenges of Surface will be described to achieve a highly reliable and quality product.
About Raj N. Master
Raj joined Microsoft in 2008. He is General Manager for IC Packaging, Silicon Operations, Quality and Reliability for all hardware products in Microsoft. These include Xbox, Kinect, Surface, Accessories, Zune, Keyboard, Mouse ,Webcam, and Roundtable etc. Raj was Corporate Fellow and Chief Technologistist for AMD from 1996 -2008. He was responsible to successfully transfer the IBM C4 / BGA technologies to AMD and set up high volume manufacturing in Penang which has to date produced more then 400 million flip chip assemblies. He led the Organic packaging development and manufacturing which is now in high volume production. He was also responsible to build, qualify and provide technical direction to AMD Flip Chip Bumping and probing operations in Dresden, Germany. He provides technical guidance for equipment and processes for C4 /BGA manufacturing lines in Suzhou, Penang and Singapore. He also provided technical expertise and guidance to product lines, Failure analysis, and reliability and quality organizations within AMD. He was also manager of the Lead Free program of AMD working with US companies, Chinese Governments and EU to align the Lead Free exemptions. Raj joined AMD after spending 21 years at IBM. He was Senior Technical Staff member at IBM prior to joining AMD. He was responsible for packaging development and manufacturing as related to C4, Ball Grid Array, Column Grid Array, Board Level Reliability and Multi Layer Ceramic Substrate. . Raj has 51 U.S. patents issued to him and has published over 80 technical papers. Raj was given IEEE " Electronics Manufacturing Technology Award" For pioneering managerial and technical leadership in packaging technology and manufacturing, thermal solutions, substrate technology and manufacturing, and flip chip bumping that significantly impacted advancements of electronic products in the industry in May 2014.