Carbon nanotubes (CNTs) are one of the most promising interconnect material for future deep-submicron and nano scale technology. They are more advantageous than copper or other interconnect materials because of their robustness to electromigration. In this paper, the RLC interconnect models are presented on basis of multi-walled CNT (MWNT) and bundled single-walled CNT (SWNT) by including the concept of CMOS driver. By performing HSPICE simulations, the effect of crosstalk is examined for the both kinds of CNTs. A comparative analysis has been done for crosstalk delay and area for these both kinds of CNTs. From simulation results, it has been observed that numbers of SWNTs in bundle are more than the number of shells in MWNTs for same performance of crosstalk delay. Furthermore, irrespective of the type of CNTs, crosstalk delay is extensively affected by transition time, diameter of CNTs and spacing between two lines (generally referred as aggressor and victim).